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    1. Labs
    2. VTU THEORY
    3. VTU Sem 2
    4. ENGINEERING CHEMISTRY
    5. Module – 2
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    electro less plating of copper & manufacture of double sided Printed Circuit Board with copper.
    distinction between electroplating and electro less plating
    Electro less plating: Introduction
    Electroplating of chromium and gold (acidic cyanide bath)
    structure modifiers & wetting agents
    levellers
    brighteners
    additives-complexing agents
    temperature & throwing power of plating bath
    pH
    metal ion & electrolyte
    concentration of metal salt
    Factors influencing the nature of electro deposit-current density,
    decomposition potential and overvoltage
    principles governing-Polarization
    Introduction
    Electroplating:
    Technological importance
    Metal Finishing: Introduction
    Cathodic protection (sacrificial anodic and impressed current methods).
    • 1 (current)
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